专业HT-R260 锡球植球炉采购

专业HT-R260 锡球植球炉采购
HT-R260锡珠焊接台                                                    特点:                                                               1.优良发热材料,数显温控表和数显时间制,控湿稳定可靠
2.可实时观察BGA锡珠的熔化情况,排除环境因素干扰
3.轴流风扇冷却,保证箱体安全温度
4.合金铝板底部加热,温度精度高,波动小,杜绝对BGA芯片造成伤害
5.可同时焊接不同规格BGA芯片
6.焊接完毕具声音报警功能                                             
 主要规格:                                                        
1.发热面积:120MM*200MM                                             
2.功率:800W                                                       
3.温度设定:室温~350℃可调,PID控温.                                 
4.定时时间:0.1--9.9分钟.                                           
5.工作电压:AC220V,其余电压可选．                                    
6.外形尺寸:310MM*280MM*145MM(L*W*H).                                
7.重量:约7.7KG.



.宏腾时代科技|||专业HT-R260 锡球植球炉采购